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| Molibdenum | Tungsten | Tatanlum | Niobium | Chromium |
| Tigas(20℃) | Stress-relief annealed:＞ 220（HV10） na-recrystallize＞160 – 180[HV10] | stress-relief annealed:＞460(HV30) na-recrystallize＞360（HV30） | deformed：120 – 220 [HV10] na-recrystallize：80 – 125[HV10] | deformed：110 – 180 [HV10] recrystallized：60 – 110[HV10] | 180 – 250 [HV10] |
| Modulus ng elasticity（20℃） | 320 [GPa] | 405 [GPa] | 186 [GPa] | 104 [GPa] | 294 [GPa] |
| Coefficient ng linear thermal expansion（20℃） | 5.2 · 10-6 [m/(m·K)] | 4.4 · 10-6 [m/(m·K)] | 6.4 · 10-6 [m/(m·K)] | 7.1 · 10-6 [m/(m·K)] | 6.2 · 10-6 [m/(m·K)] |
| Thermal conductivity(20℃) | 142 [W/(m ·K)] | 164 [W/(m·K)] | 57.5 [W/(m·K)] | 53.7 [W/(m·K)] | 93.7 [W/(m·K)] |
| Tukoy na init(20℃) | 0.25 [J/(g·K)] | 0.13 [J/(g·K)] | 0.14 [J/(g·K)] | 0.27 [J/(g·K)] | 0,45 [J/(g·K)] |
| Electrical conductivity(20℃) | 17.9 · 106 [1/(Ω·m)] | 18.2 · 106 [1/(Ω·m)] | 8 · 106[1/(Ω·m)] | 7.1 · 106[1/(Ω·m)] | 7.9 · 106 [1/(Ω·m)] |
| Tukoy na electrical resistance（20℃） | 0,056 [(Ω·mm2)/m] | 0.055 [(Ω·mm2)/m] | 0.125 [(Ω·mm2)/] | 0.141 [(Ω·mm2)/m] | 0.127 [(Ω·mm2)/m] |
| Pag-andar ng electron work | 4,39 [eV] | 4.54 [eV] | 4.3 [eV] | 4.3 [eV] | 4,5 [eV] |
| Recrystallization temperatura | 1100 ℃ | 1350 ℃ | 900-1450 ℃ | 850 – 1,300 °C |
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Oras ng post: Set-29-2019